NTMD4820N
PACKAGE DIMENSIONS
? Y ?
B
? X ?
8
1
A
5
4
S
0.25 (0.010)
M
Y
SOIC ? 8 NB
CASE 751 ? 07
ISSUE AJ
M
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751 ? 01 THRU 751 ? 06 ARE OBSOLETE. NEW
STANDARD IS 751 ? 07.
G
MILLIMETERS
INCHES
SOLDERING FOOTPRINT*
0 _ 8 _
? Z ?
H
D
0.25 (0.010)
M
Z Y
C
S
X
SEATING
PLANE
0.10 (0.004)
S
N X 45 _
M
1.52
0.060
J
DIM MIN MAX
A 4.80 5.00
B 3.80 4.00
C 1.35 1.75
D 0.33 0.51
G 1.27 BSC
H 0.10 0.25
J 0.19 0.25
K 0.40 1.27
M
N 0.25 0.50
S 5.80 6.20
STYLE 11:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
MIN MAX
0.189 0.197
0.150 0.157
0.053 0.069
0.013 0.020
0.050 BSC
0.004 0.010
0.007 0.010
0.016 0.050
0 _ 8 _
0.010 0.020
0.228 0.244
7.0
0.275
0.6
0.024
4.0
0.155
1.270
0.050
SCALE 6:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
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NTMD4820N/D
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